Manufacturers

Coiltronics: Transformers & power inductors for high frequency DC-DC and switch mode apps.

PowerStor: "Aerogel" high capacitance/low ESR devices with 2000 times the volumetric capacitance of aluminum electrolytic capacitors.

PolySURG: Polymer based material to protect sensitive circuits from the effects of ESD.

Bussmann: Fuses for circuit protection including chip, brick, subminiature and ferrule types.

Connectors: Applications include Industrial, Telecom/Datacom & factory automation featuring DIN, Harting HAN modular system, power connectors for AdvancedTCA and MicroTCA, Harting RJ Ethernet terminations.

Assemblies: Backplane, cable.

Metalized Thermal Interface Materials (TIM): World's leading refiner, producer and fabricator of indium for use in thermal applications. Products include solder pastes, preforms, fluxes, alloys and thermal interface materials for TIM1 and TIM2 applications.

Ceramic Capacitors: SMT, Through Hole & High Frequency.

Filters: EMI/RFI (SMT), SAW, Ceramic & Chip Inductors.

Oscillators: Ceramic Resonators.

RF & Microwave: Dielectric & Duplexers, LC Filters, Isolators.

Inductors: Chip, Multilayer, Wire wound & Ferrite beads.

Modules: Bluetooth, WiFi.

Power electronics: #1 supplier of board mount power and the 4th largest supplier overall of power electronics including dc-dc converters, ac-dc power, high-reliability power supplies, digital panel meters, magnetics, data acquisition devices.

Oscillators: including clock types and a full range of TCXO, VCXO, OCXO, VCTCXO products based on in-house synthetic quartz. Through hole and SMT mounting, plastic and ceramic packages. Products for Bluetooth, WLAN, Sonet, 10GbE. Crystals: Through hole and SMD. Crystal filters and SAW devices also offered.

Relays: Electromechanical (Signal, High Frequency, Power, Automotive, High Power and General Purpose), Solid State/PhotoMOS (Power DIP, Multichannel, Low On-Resistance, Power, High Sensitivity and Modular).

Connectors: Narrow pitch (.35mm to 1.0mm), Low profile stacking starting at 9mm; LCD, USB, IEEE1394, RF (coaxial).

Switches: Snap action "Turquoise", IC Card Detection.

Sensors: Light, motion, pressure, 3D Image Sensor.

Memory - DRAM & Flash: Design, development and manufacture for high quality memory applications in Industrial, Embedded, Communications & Networking, Military & Aerospace, Transportation, Gaming and Medical. Includes hi temp and packaging solutions.